Postdoc in Scaling Interconnects for Ultra High-Throughout Chip Assembly

  • Delft

TU Delft

Passionate about microelectronics and cutting-edge innovation? Join us in transforming high-speed microassembly into ultra-high-speed! We’re seeking a Postdoc researcher to optimize novel interconnects for ultra-fast, reliable chip assembly. Work with top experts at TU Delft’s ECTM and a leading company of the field, and help shape next-generation technologies that reduce costs and environmental impact.

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